TechOnline India Header
All Articles Products Courses Papers VirtuaLabs Webinars
Top Search Items
C


Techpaper Spotlight

Wind River
Accelerating the Development of Embedded Linux Devices with JTAG On-Chip Debugging
    Login | Register | Welcome, Guest

Topics
 



Expanding Multiphysics applications with COMSOL Version 4.2
COMSOL has announced the release of the latest version of COMSOL Multiphysics, its simulation environment. Version 4.2, which expands the scope of applications covered by COMSOL, is now available.

COMSOL has announced the release of the latest version of COMSOL Multiphysics, its simulation environment. Version 4.2, which expands the scope of applications covered by COMSOL, is now available and will be shipped to all customers with current subscriptions.

“The vision behind Version 4 was to provide a foundation for our customers to reach broader audiences,” says Svante Littmarck, President and CEO of COMSOL.

“The implication, and what we’re delivering with 4.2, is an expanded product offering based on that platform.”  Version 4.2 expands the applications covered by COMSOL with three new application modules – Microfluidics, Geomechanics, and Electrodeposition – and new LiveLink interfaces for AutoCAD and SpaceClaim.

“This release really bolsters our offerings to meet market demands in several directions,” says Littmarck. “Mechanical, electromagnetic, chemical, fluid, and CAD interoperability are all covered in this release. Even areas not explicitly addressed will benefit from the improved solver technology.”“The list of features included in Version 4.2 is indeed impressive,” adds Littmarck.

“By any measure, this is a major release. General geometry and meshing, solvers, postprocessing, and, as COMSOL’s customers have come to expect, user interface enhancements have all been upgraded. These new capabilities reach all products throughout the COMSOL environment, both existing and new.”

1
 
Latest Webinars
· The Next Generation of Ethernet: How the New IEEE Standards Enable Energy Efficiency and Quality-of-Service
· Simplified Physical Layer Receiver Test of Re-timed Architectures Such as USB 3.0, SATA, SAS, PCIe 2
· How to solve the most common high-speed bus issues in embedded design on a budget
· Early access to ARM Core Technology with Fast Models from ARM
· Latest MIPI Standards: PHY and Protocol Testing Guidance
 
Member Company Spotlight
Xilinx
 

Start Your Spartan-3A FPGA DSP Design Now! Evaluate Free Downloadable Tools Built Just for You.


Member Companies