Next month's International Solid State Circuits Conference will present the 'best of the best' circuits implemented by researchers in imagers, MEMS, sensors and displays.
Here are some highlights from ISSCC:
A new stable RGBW AMOLED display with OLED degradation compensation that substantially reduces image sticking and increases the useful lifetime of active OLED displays. Paper number [6.3]
A signal processor with the lowest-reported power consumption that extracts the heart's rhythm with elegant simplicity. This circuit consumes only 30microW, enabling it to run off a small battery for months, constantly monitoring the state of the patient for the diagnosis of chronic illness. Paper number [6.6]
Integrated temperature sensors that need no calibration can be used anywhere and everywhere! Quality is not sacrificed with 0.2deg.C 3sigma accuracy from -55deg.C to 125deg.C. Paper number [17.4]
A new aluminum-nitride-on-silicon resonator that is an important step towards integrating high-Q, low-phase-noise reference oscillators on-chip. The associated trans-impedance amplifier has a gain greater than 76dB-Ohm across a bandwidth of 2.5GHz, with a figure-of-merit of 2190GHzOhm/mW, with a 500femtoFarad load. Paper number [17.6]
Time-of-flight sensor with the smallest pixel which enables the first generation of range-finding sensors for gaming applications. Integrated optical sensors and interfaces provides an 80-60 pixel range-finding image sensor with 10-10 micron sq. lock-in pixels. Paper number [22.7]
The first backside-illuminated (BSI) CMOS image sensor with 10Mpixel resolution. The BSI sensor with 1/2.3-inch 10.3 Mpixel image uses1.65-1.65 micron sq. pixels, operates up to 50 frames per second. Paper number [22.9]
For more, see here.
Also, a paper from MIT is intriguing in that it describes a CMOS image sensor, based on a 3-D stacking technology.
Get ISSCC-ed first week in February! And come back to us with your impressions.
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