TechOnline India Header
Most Popular
Top 5 Courses
  • Fundamentals of PCB Design
  • Fundamentals of Multicore Programming
  • Eliminating Audible Transients in Audio Systems
  • DC-DC Converter Theory
  • Fundamentals of Wireless
    Most Popular
    Top 5 Technical Papers
  • Digital Signal Processing: A Practical Guide (Part 1)
  • SDRAM Memory Systems: Architecture Overview and Design Verification
  • ARM Platform Technical Overview
  • Reference Design for a SEPIC LED Driver
  • Solving the System-Level Thermal Management Challenges of LEDs
    Most Popular
    Top 5 Webinars
  • Designing embedded HMIs and connecting them to hardware
  • Is Android the Right Foundation for Your Next Device?
  • 2009 Embedded Market Study
  • Maximizing OpenGL(R) ES 2.0 on GPUs for Embedded Applications
    All Articles Products Courses Papers VirtuaLabs Webinars
    Top Search Items
    scsi


    Techpaper Spotlight

    Wind River
    Accelerating the Development of Embedded Linux Devices with JTAG On-Chip Debugging
    /
        Login | Register | Welcome, Guest

    Topics
    POLL
    How much code have you produced in your career?
    A few KLOC
        38%
    100s of KLOC
        44%
    Millions of LOC
        11%
    A trillion
        7%
     



    Vishay showcases in Shanghai
    Industrial Control Designline
    Vishay Intertechnology, Inc. will showcase at electronica and Productronica China (epChina) 2010, taking place March 16-18 at the Shanghai New International Expo Center.

    The company will present its latest capacitors, inductors, resistors, diodes and modules, power Mosfets, power ICs, and optocouplers.

    Vishay will also participate in two forums on Tuesday, March 16 at the 2010 Symposium on Future Developments and Applications of Power Electronics Technology.

    Vincent Hu, Senior FAE Business Development, Vishay Asia, will have a talk on "Easily Achieve Greater Than 90 percent Efficiency in Multi-Phase of DC/DC Conversion."

    Michael Huang, Vishay Regional Marketing Manager, Capacitors, will present "High Reliability Capacitors in Industry/Aero Applications," at epChina 2010.

    1
     
     
    Latest Webinars
    · The Next Generation of Ethernet: How the New IEEE Standards Enable Energy Efficiency and Quality-of-Service
    · Simplified Physical Layer Receiver Test of Re-timed Architectures Such as USB 3.0, SATA, SAS, PCIe 2
    · How to solve the most common high-speed bus issues in embedded design on a budget
    · Early access to ARM Core Technology with Fast Models from ARM
    · Latest MIPI Standards: PHY and Protocol Testing Guidance
     
    Member Company Spotlight
    OCP International Partnership
     

    Read the latest OCP IP white paper, "The Importance of Sockets in SOC Design". This paper introduces the Open Core Protocol (OCP) within the context of contemporary System On a Chip (SOC) design issues. View the paper here.


    Member Companies