Interplex announces new SMT press fit product

by K C Krishnadas, TechOnline India - February 08, 2012

The product is a discreet pick and place SMT component that creates a solderless edge card interconnection for daughter board applications.

Interplex Engineered Products, a supplier of stamped, plated and molded precision components and a division of has introduced a new patent-pending Surface Mount Technology (SMT) Card-Edge Connector System based on the company’s press-fit technology.

The product is a discreet pick and place SMT component that creates a solderless edge card interconnection for daughter board applications. These SMT Card-Edge contacts can be placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution which allows for high mechanical strength at the point of connection. 

The SMT Card Edge Contact System is designed for standard 1.6 mm (0.062”) thick printed circuit boards (PCB’s) but is compatible with additional PCB thicknesses. The center minimum PCB spacing is 3.2 mm (0.126”). 

The product features Interplex’s 0.64 mm press-fit technology and is packaged in a 16 mm x 4 mm pitch EIA tape on a 13” diameter plastic reel for compatibility to standard high-speed surface mount pick-and-place equipment. It is suitable for high-conductivity material, able to carry up to 15 amps per contact.
 
For more on the learn more about Interplex’s SMT Card-Edge Contact System, visit http://www.interplex.com/card-edge
 

About Author

Comments

blog comments powered by Disqus