JEDEC Solid State Technology Association, into developing standards for the microelectronics industry, has announced the availability of a new standard for Wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate (SDR).
Wide I/O mobile DRAM will meet industry demands for increased levels of integration as well as improved bandwidth, latency, power, weight and form factor; providing performance, energy efficiency and small size for smartphones, tablets, handheld gaming consoles and other mobile devices. JESD229 may be downloaded free of charge from the JEDEC website at http://www.jedec.org/sites/default/files/docs/JESD229.pdf.
Wide I/O mobile DRAM enables chip-level three dimensional (3D) stacking with Through Silicon Via (TSV) interconnects and memory chips directly stacked upon a System on a Chip (SoC). The standard defines features, functionalities, AC and DC characteristics, and ball/signal assignments.
It is suited for applications needing extreme power efficiency and increased memory bandwidth (up to 17GBps). Examples include 3D Gaming, HD Video (1080p H264 video, pico projectors), and running multiple applications simultaneously. Wide I/O offers twice the bandwidth of the previous generation standard, LPDDR2, at the same rate of power consumption.
“High performance mobile devices such as smartphones and tablets require high bandwidth and density, driven by demands for improved performance. JEDEC’s JC-42.6 Subcommittee is pleased to provide a solution to this industry need with the publication of JESD229 for Wide I/O mobile DRAM, which will support the high resolution display, high quality graphics and multi-tasking capabilities required by device end users now and in the future,” said Sophie Dumas, Chairman of the JC-42.6 Subcommittee for Low Power Memories.
All JEDEC standards are available online, at no charge and for more information, visit www.jedec.org.