Broadcom introduces microwave outdoor unit on a chip

by K C Krishnadas, TechOnline India - February 08, 2012

The SoC combines functionality of up to 10 standard products, is a single chip solution for both microwave split-mount and full/all outdoor units and cuts size, complexity, production cost and power consumption

Broadcom has introduced what it claims is the world’s first microwave outdoor unit (ODU) on a chip. The BCM85810 combines the functionality of up to 10 off-the-shelf chips, reducing the size, complexity, production cost and power consumption of microwave radio frequency units (RFUs). 

Designed to address the need for higher bandwidth and faster time-to-market in microwave split-mount and full/all outdoor units (FODU/AODU), the BCM85810 RF system-on-a-chip (SoC) is based on a flexible architecture, enabling various types of system architectures such as split-mount (IDU-ODU) and all-outdoor (All-ODU) on a common hardware platform.

With only two variants to cover all standard point-to-point microwave frequency bands and all channel bandwidths, the BCM85810 single chip solution simplifies system manufacturing, deployment, and inventory management. With support for modulation, the BCM85810 is better at spectrum utilization and capacity.

With mobile data traffic expected to  quadruple by 2015 as the number of mobile users and use of multimedia services continues to rise, mobile operators are investing in next generation mobile backhaul networks to meet the performance and bandwidth requirements of backhauling data from the cell sites to the core networks. 

"The introduction of our BCM85810 single chip solution marks the expansion of Broadcom’s microwave backhaul portfolio into the RF domain, as we have done in multiple solutions including Wi-Fi, cellular, Bluetooth, and cable modems," said Dan Charash, Senior Director and General Manager, Microwave, Broadcom Corporation.

Key Features:

• Combines functionality of up to ten off-the-shelf ASSPs including synthesizers (IF and RF), LNA, AGCs, BPF Bank, LPF Bank, IR Mixers, VGA and VVA with wide dynamic range, PA driver and Power detectors
• Only two variants to cover all standard point-to-point microwave spectrum
• Wide AGC dynamic range (>70dB)
• Internal power controls
• Maintains Rx output power over full input power range
• On-chip selectable baseband filters
• ETSI and FCC compliance
 
The SoCs and a complete reference design, system analysis and comprehensive development kit are also available. 
 

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