The UPG2253T6S FEIC combines a power amplifier (PA), low pass filter (LPF), and two single pole double throw switches (SPDT) into a single chip. By integrating these components into one die, the UPG2253T6S FEIC reduces component count, saves total bill of materials (BOM) cost, simplifies procurement, and decreases the printed circuit board (PCB) space required for many new embedded product designs. The UPG2253T6S FEIC eliminates the need for RF component matching, which simplifies board design and reduces component count.
Applications include Bluetooth modules that are designed into notebooks, mobile phones, and headsets as well as ZigBee/802.15.4 modules, which have wide applicability in automatic meter reading, wireless security, cable replacement, and lighting systems in both commercial and residential buildings.
The UPG2253T6S FEIC is housed in a 12 pin QFN package measuring 3 mm x 3 mm x 0.7 mm. Additional features include DC: Vd = Ven = Vsm = 3.0V; Tx: Po = 19 dBm; PAE = 28%; Idd = 95 mA; 2f0 = -25 dBm; and 3f0 = -40 dBm. Rx: Loss = 1.5 dB typical.
Pricing: $1.10 in quantities of 100,000.
Availability: Shipping now.
Datasheet: click here.
California Eastern Laboratories, www.cel.com