Power conversion modules are key hardware building blocks critical to electronic products' quality and reliability. Power continues to evolve rapidly with increasing current and power densities. There are many different qualification processes at both the supplier and OEM (Original Equipment Manufacturer) level. At the same time products encounter a variety of harsh applications world-wide that are not accounted for in all qualification processes.
IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries, was developed by a group of major OEMs and suppliers to provide a common set of test requirements to proactively complete a comprehensive test regimen that will satisfy both OEM and their end customer requirements.
Evidence of corrosion on gold-plated pins following MFG test.
The IPC-9592 standard was officially released in September 2008, and sets the requirements for the design, qualification, and manufacturing quality / reliability processes of power conversion devices for the computer and telecom industries. This standard provides guidance to help reduce the risk of known quality and reliability problems in power conversion devices.
Revision A of the IPC-9592 standard was officially released in May 2010. This is an enhanced version of the original standard, which provides additional guidance on corrosion, MSL (Moisture Sensitivity Level), module preconditioning, and HALT (Highly Accelerated Life Test) testing.
Corrosion has become a significant issue in harsh applications where the proper mitigation steps have not been addressed in the design. Figure 1 is an example of creep corrosion and Figure 2 exemplifies sulfur corrosion post MFG (Mixed Flowing Gases) testing. Standard qualification tests will not expose these potential problems before the product is released to the customer.
This article looks at corrosive agents, design for reliability (DfR), packaging and labeling, the seven HALT (accelerated life test) procedures (including Input Voltage Test and the Output Load Test), and more. To read it, click here.
About the authors:
Don Gerstle is VP Design Quality at Murata Power Solutions (MPS). Gerstle has been with for 14 years MPS and C&D Technologies Power Electronics Division prior to being acquired by Murata.
Neil Witkowski is a Senior Reliability Engineer at Alcatel-Lucent. Witkowski's 28 year career with Alcatel-Lucent has been focused on electronic component selection, quality and reliability.
Editor's note: Liked this? Want more?
If you are interested in "power" issues such as components; efficiency; thermal concerns; AC/DC and DC/DC supply topologies; batteries; supply ICs; complete supplies; single- and multi-rail management; and supply monitoring: then go to the Power Management Designline home page here for the latest in design, technology, trends, products, and news. Also, sign up for our weekly Power Management Designline Newsletter here.