Baolab announces evaluation kits for its NanoEMS MEMS

by K C Krishnadas, TechOnline India - January 20, 2012

This will use patented Baolab NanoEMS technology to create nanoscale MEMS (Micro Electro Mechanical Systems) within the standard metal structure of a high volume manufactured CMOS wafer.

Baolab Microsystems has said it will have evaluation kits of its 3D NanoCompass available before March this year. This electronic 3-axis CMOS MEMS NanoCompass technology uses Baolab's patented NanoEMS technology to create nanoscale MEMS (Micro Electro Mechanical Systems) within the standard metal structure of a high volume manufactured CMOS wafer.

The Barcelona, Spain-based Baolab has developed a technology called NanoEMS that enables MEMS to be created inside the CMOS wafer using standard manufacturing techniques. This enables them to be made an order of magnitude smaller than existing techniques of building MEMS on the surface of the wafer and also at a fraction of the cost.

"We are now producing NanoEMS sensors in volume in a standard CMOS production line. The move from lab to fab is a significant milestone for the company, proving that our innovative technology is reliable, scalable and repeatable. This was the critical stage that our customers have been waiting for. NanoEMS makes it easier and more cost effective to integrate MEMS sensors with microcontrollers and associated electronics all on the same chip in the same CMOS production line. This is the breakthrough that will enable high volume, consumer electronics products to have intelligent sensors, meeting the increasing demand for smarter, more aware devices," said Dave Doyle, Baolab's CEO. 

NanoEMS technology not only offers significant cost reductions in motion MEMS sensors but Baolab envisages the possibility for NanoEMS structures to be  incorporated into ASICs for applications such as RF Antennas, RF switches, Near Field Communications and Automotive.

Possible areas Baolab and its customers are looking at are:-
 
Vibrating antennas

These overcome the limitations of classic (static) antennas such as compact superdirective/superesolution antennas/lenses that require phase shifters and gains with an accuracy not currently realistic. Vibrating antennas make these feasible along with spatial multiplexing communications for mobile telecoms and internet.
 
Thermo-magnetic RF switches & antennas

By exploiting the low value of the Curie temperature of Nickel, it is possible to build RF switches, filters and reconfigurable antennas. This creates a novel category of reconfigurable RF MEMS components which are very reliable, as there are no moving parts, achieving compelling RF specs, low power consumption and low cost thanks to CMOS processing.
 
Modal switches

This new topology enables compelling specifications for RF switches with low-capacitance ratio and high isolation, using low cost, low resistivity CMOS substrates. The principle is based on transferring power from the different transmission modes in a transmission line, using reconfigurable MEMS loads to balance and unbalance the line.
 
Integrated passives: inductors, transformers, capacitors

Integrated inductors with a helicoidal shape typical of off-chip inductors, offer reduced losses (higher Q) and smaller parasitic capacitance (higher resonant frequency). It is also possible to create transformers with any winding ratio.
 
Integrated capacitors for low frequency applications, especially power, where the tangent capacitance is used instead of the traditional approach using secant capacitance. When capacitors are used in voltage regulators, just a fraction of the charge stored in the capacitor is usually used to regulate the voltage. This kind of capacitor allows a higher percentage of the stored charge to be used to regulate the voltage, which makes it possible to implement smaller, integrated filters and regulators, with superior performance.
 
RF filters

The small feature size of CMOS processing makes it is possible to implement RF MEMS filters up to the GHz band required for cell phone communications and significantly increase the electromechanical coupling. Current MEMS RF mechanical filters have a problem with very low electromechanical coupling, which means low sensitivity, that they try to offset by means of using a very high voltage but with limited success.
 
Power converters

NanoEMS MEMS enable integrated charge pumps and power supplies, which are lower in cost, more compact and more efficient.









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